We supply low to high layer count printed circuit boards and backplanes, including large format oversized panels and high aspect ratio plating, where we understand the importance of signal integrity and impedance control requirements. We offer world-class material and processing expertise in RF & microwave applications, including mixed material constructions, blind and buried via structures and cavity designs which are key competencies our customers rely upon.

Our key telecommunications global manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality.

construction service